FFKM Kalrez 9100 O-Ring, Size: -016
Material: FFKM Kalrez 9100 O-Ring
Size: AS568 -016 O-Ring
Part Number: KP9100-OR-016
Kalrez® (Dupont)
9100
FFKM (Perfluoroelastomer)
70
Shore A
Semiconductor Material
Color: Translucent Amber
Detailed Description
KP9100-OR-016 is a Translucent Amber, 70 Shore A, FFKM (Perfluoroelastomer) O-Ring made from Kalrez® (Dupont). Kalrez® (Dupont) 9100 is manufactured with the following features & specifications: Semiconductor Material. KP9100-OR-016 is AS568 size -016 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 15.6mm (Inside Diameter (ID)).
Material: FFKM Kalrez 9100 O-Ring
Size: AS568 -016, 1.78mm CS X 15.60mm ID (0.070" CS X 0.614" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | KP9100 |
| Brand | Kalrez® (Dupont) |
| Material | FFKM (Perfluoroelastomer) |
| Color | Translucent Amber |
| Durometer | 70 Shore A |
| High Temperature | 300 °C / 572 °F |
| Low Temperature | -12 °C / 10 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -016 |
| Cross Section (CS) | 1.78 mm / 0.070 in |
| Inside Diameter (ID) | 15.60 mm / 0.614 in |
| Other Specifications | |
Semiconductor Material | |
DuPont™ Kalrez® 9100 (KP9100) is a 70 Shore A translucent amber perfluoroelastomer (FFKM) specifically engineered for advanced semiconductor plasma applications where ultra-low particle generation and minimal erosion are critical to process yield. Designed for PECVD, ALD, HDPCVD, and conductor etch environments, Kalrez® 9100 delivers excellent resistance to oxygen- and fluorine-based plasmas while maintaining very low outgassing and low metallic ion content. With a maximum recommended service temperature of 300°C (572°F), it provides strong thermal stability, good mechanical strength, and reliable elastic recovery in harsh dry process chemistries. Its non–carbon black, polymeric filler formulation significantly reduces the risk of particle contamination compared to traditional filled FFKM materials.
Kalrez® 9100 is commonly used in O-rings and gaskets for gas inlet and orifice seals, chamber lid seals, isolation valves, slit valve doors, and select bonded gate valve applications in semiconductor process tools. It has demonstrated extended preventive maintenance intervals, reduced erosion, and longer seal life in real-world fab environments operating high-power NF₃ plasma cleaning cycles. This material is selected when process consistency, low particle generation, and long-term seal durability directly impact wafer yield. Canyon Components offers equivalent translucent, low-etch, low-particle FFKM materials engineered for semiconductor plasma and deposition applications with similar thermal and contamination control requirements.
Common relevant keywords:
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