FFKM Parofluor FF302-75 O-Ring, Size: -011
Material: FFKM Parofluor FF302-75 O-Ring
Size: AS568 -011 O-Ring
Part Number: FF302-75-OR-011
Parofluor® (Parker)
FF302-75
FFKM (Perfluoroelastomer)
75
Shore A
Etch Resistant, Low Metal Ions
Semiconductor Material
Color: Brown
Detailed Description
FF302-75-OR-011 is a Brown, 75 Shore A, FFKM (Perfluoroelastomer) O-Ring made from Parofluor® (Parker). Parofluor® (Parker) FF302-75 is manufactured with the following features & specifications: Etch Resistant, Low Metal Ions, Semiconductor Material. FF302-75-OR-011 is AS568 size -011 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 7.65mm (Inside Diameter (ID)).
Material: FFKM Parofluor FF302-75 O-Ring
Size: AS568 -011, 1.78mm CS X 7.65mm ID (0.070" CS X 0.301" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | FF302-75 |
| Brand | Parofluor® (Parker) |
| Material | FFKM (Perfluoroelastomer) |
| Color | Brown |
| Durometer | 75 Shore A |
| High Temperature | 320 °C / 608 °F |
| Low Temperature | -15 °C / 5 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -011 |
| Cross Section (CS) | 1.78 mm / 0.070 in |
| Inside Diameter (ID) | 7.65 mm / 0.301 in |
| Other Specifications | |
Etch Resistant, Low Metal Ions | |
Semiconductor Material | |
Parker’s FF302-75 is a 75 Shore A ultra-high-purity perfluoroelastomer (FFKM) developed specifically for advanced semiconductor deposition and etch processes where wafer yield and contamination control are critical. Rated for continuous service up to 600°F (315°C), FF302 combines extremely low metallic ion content with excellent resistance to oxygen and fluorine plasmas, addressing the long-standing tradeoff between purity and etch resistance. Unlike traditional non-filled FFKM compounds that erode quickly or metal-oxide-filled grades that introduce contamination risk, FF302 delivers a much slower etch rate in aggressive chemistries such as CF₄, NF₃, O₂, and O₃ while maintaining exceptionally low extractables. Its low particle generation and stable physical properties make it well suited for high-end semiconductor environments where process drift and seal wear directly impact yield.
FF302-75 is commonly used as O-rings and custom seals in deposition and etch chambers, including CVD, PECVD, ALD, and plasma-based processes operating in oxygen and fluorine-rich environments. Its ability to maintain cleanliness and sealing integrity over extended service intervals reduces downtime and seal replacement frequency in critical tools. This ultra-clean FFKM formulation is designed for fabs pushing the limits of process control and contamination reduction. Canyon Components offers equivalent ultra-low-metal, low-etch FFKM materials engineered for semiconductor deposition and plasma applications requiring similar purity, plasma resistance, and high-temperature performance.
Common relevant keywords:
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