FF302-75 Datasheet

Parker’s FF302-75 is a 75 Shore A ultra-high-purity perfluoroelastomer (FFKM) developed specifically for advanced semiconductor deposition and etch processes where wafer yield and contamination control are critical. Rated for continuous service up to 600°F (315°C), FF302 combines extremely low metallic ion content with excellent resistance to oxygen and fluorine plasmas, addressing the long-standing tradeoff between purity and etch resistance. Unlike traditional non-filled FFKM compounds that erode quickly or metal-oxide-filled grades that introduce contamination risk, FF302 delivers a much slower etch rate in aggressive chemistries such as CF₄, NF₃, O₂, and O₃ while maintaining exceptionally low extractables. Its low particle generation and stable physical properties make it well suited for high-end semiconductor environments where process drift and seal wear directly impact yield.

 

FF302-75 is commonly used as O-rings and custom seals in deposition and etch chambers, including CVD, PECVD, ALD, and plasma-based processes operating in oxygen and fluorine-rich environments. Its ability to maintain cleanliness and sealing integrity over extended service intervals reduces downtime and seal replacement frequency in critical tools. This ultra-clean FFKM formulation is designed for fabs pushing the limits of process control and contamination reduction. Canyon Components offers equivalent ultra-low-metal, low-etch FFKM materials engineered for semiconductor deposition and plasma applications requiring similar purity, plasma resistance, and high-temperature performance.

 

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