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FF376-80-OR-006
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CS

0.070 in

(1.78 mm)

ID

0.114 in

(2.90 mm)

ORing cut reference

See Data Sheet


FFKM Parofluor FF376-80 O-Ring, Size: -006

Material: FFKM Parofluor FF376-80 O-Ring

Size: AS568 -006 O-Ring

Part Number: FF376-80-OR-006

Parofluor® (Parker)

FF376-80

FFKM (Perfluoroelastomer)

80

Shore A

Low Particle Generation, Low Metal Ions

Color: Purple

Detailed Description

FF376-80-OR-006 is a Purple, 80 Shore A, FFKM (Perfluoroelastomer) O-Ring made from Parofluor® (Parker). Parofluor® (Parker) FF376-80 is manufactured with the following features & specifications: Low Particle Generation, Low Metal Ions. FF376-80-OR-006 is AS568 size -006 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 2.9mm (Inside Diameter (ID)).


Material: FFKM Parofluor FF376-80 O-Ring


Size: AS568 -006, 1.78mm CS X 2.9mm ID (0.070" CS X 0.114" ID)

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Technical SpecificationValue
Compound NumberFF376-80
BrandParofluor® (Parker)
MaterialFFKM (Perfluoroelastomer)
ColorPurple
Durometer80 Shore A
High Temperature320 °C / 608 °F
Low Temperature-15 °C / 5 °F
Geometry Specifications
Cross Sectional GeometryO-Ring
Size StandardAS568
Size-006
Cross Section (CS)1.78 mm / 0.070 in
Inside Diameter (ID)2.90 mm / 0.114 in
Other Specifications

Low Particle Generation, Low Metal Ions

ORing cut reference
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Parker’s FF376-80 is an 80 Shore A deep-purple perfluoroelastomer (FFKM) developed for ultra-low particle generation and minimal extractables in the most demanding semiconductor plasma environments. As a Parofluor ULTRA material, FF376-80 contains no inorganic filler systems and no phosphorus, resulting in extremely low metallic ion content and among the lowest extractable levels in its class. Rated for continuous operation up to 600°F (315°C), it delivers a low erosion rate with excellent resistance to aggressive oxygen and fluorine plasmas while providing higher hardness for improved dimensional stability and extrusion resistance. This balance of purity and robustness makes FF376-80 well suited for processes where both cleanliness and mechanical strength are critical to yield.

 

FF376-80 is recommended for O-rings and molded shapes used in deposition and etch applications including CVD, HDPCVD, SACVD, PECVD, and etching or ashing. Typical uses include chamber seals, slit valve and gate valve doors, ISO valves, wafer pads, target lids, heater and lamp assemblies, and quartz window seals where particle control and plasma durability are paramount. Canyon Components offers equivalent ultra-low-extractable, low-particle FFKM materials engineered for semiconductor deposition and plasma applications requiring comparable purity, plasma resistance, and high-temperature capability.

 

Common relevant keywords:
low particle generation FFKM, ultra low extractables elastomer, plasma resistant O-rings, fluorine plasma compatible seals, oxygen plasma sealing materials, high purity semiconductor elastomers, CVD chamber O-rings, PECVD slit valve seals, etch chamber gate valve O-rings, wafer processing clean seals, 600°F perfluoroelastomer, Parofluor ULTRA equivalent, Datasheet, TDS, Test Report, MTR, MSDS, SDS