FFKM Parofluor FF376-80 O-Ring, Size: -008
Material: FFKM Parofluor FF376-80 O-Ring
Size: AS568 -008 O-Ring
Part Number: FF376-80-OR-008
Parofluor® (Parker)
FF376-80
FFKM (Perfluoroelastomer)
80
Shore A
Low Particle Generation, Low Metal Ions
Color: Purple
Detailed Description
FF376-80-OR-008 is a Purple, 80 Shore A, FFKM (Perfluoroelastomer) O-Ring made from Parofluor® (Parker). Parofluor® (Parker) FF376-80 is manufactured with the following features & specifications: Low Particle Generation, Low Metal Ions. FF376-80-OR-008 is AS568 size -008 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 4.47mm (Inside Diameter (ID)).
Material: FFKM Parofluor FF376-80 O-Ring
Size: AS568 -008, 1.78mm CS X 4.47mm ID (0.070" CS X 0.176" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | FF376-80 |
| Brand | Parofluor® (Parker) |
| Material | FFKM (Perfluoroelastomer) |
| Color | Purple |
| Durometer | 80 Shore A |
| High Temperature | 320 °C / 608 °F |
| Low Temperature | -15 °C / 5 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -008 |
| Cross Section (CS) | 1.78 mm / 0.070 in |
| Inside Diameter (ID) | 4.47 mm / 0.176 in |
| Other Specifications | |
Low Particle Generation, Low Metal Ions | |
Parker’s FF376-80 is an 80 Shore A deep-purple perfluoroelastomer (FFKM) developed for ultra-low particle generation and minimal extractables in the most demanding semiconductor plasma environments. As a Parofluor ULTRA material, FF376-80 contains no inorganic filler systems and no phosphorus, resulting in extremely low metallic ion content and among the lowest extractable levels in its class. Rated for continuous operation up to 600°F (315°C), it delivers a low erosion rate with excellent resistance to aggressive oxygen and fluorine plasmas while providing higher hardness for improved dimensional stability and extrusion resistance. This balance of purity and robustness makes FF376-80 well suited for processes where both cleanliness and mechanical strength are critical to yield.
FF376-80 is recommended for O-rings and molded shapes used in deposition and etch applications including CVD, HDPCVD, SACVD, PECVD, and etching or ashing. Typical uses include chamber seals, slit valve and gate valve doors, ISO valves, wafer pads, target lids, heater and lamp assemblies, and quartz window seals where particle control and plasma durability are paramount. Canyon Components offers equivalent ultra-low-extractable, low-particle FFKM materials engineered for semiconductor deposition and plasma applications requiring comparable purity, plasma resistance, and high-temperature capability.
Common relevant keywords:
low particle generation FFKM, ultra low extractables elastomer, plasma resistant O-rings, fluorine plasma compatible seals, oxygen plasma sealing materials, high purity semiconductor elastomers, CVD chamber O-rings, PECVD slit valve seals, etch chamber gate valve O-rings, wafer processing clean seals, 600°F perfluoroelastomer, Parofluor ULTRA equivalent, Datasheet, TDS, Test Report, MTR, MSDS, SDS


