FFKM Canrez CP70TA11 O-Ring, Size: -006
Material: FFKM Canrez CP70TA11 O-Ring
Size: AS568 -006 O-Ring
Part Number: CP70TA11-OR-006
CanRez® (Canyon Components)
CP70TA11
FFKM (Perfluoroelastomer)
70
Shore A
Semiconductor Material, Filled with Nano Particles of PTFE
Filled with Nano Particles of PTFE
Color: Translucent Amber
Detailed Description
CP70TA11-OR-006 is a Translucent Amber, 70 Shore A, FFKM (Perfluoroelastomer) O-Ring made from CanRez® (Canyon Components). CanRez® (Canyon Components) CP70TA11 is manufactured with the following features & specifications: Semiconductor Material, Filled with Nano Particles of PTFE, Filled with Nano Particles of PTFE. CP70TA11-OR-006 is AS568 size -006 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 2.9mm (Inside Diameter (ID)).
Material: FFKM Canrez CP70TA11 O-Ring
Size: AS568 -006, 1.78mm CS X 2.90mm ID (0.070" CS X 0.114" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | CP70TA11 |
| Brand | CanRez® (Canyon Components) |
| Material | FFKM (Perfluoroelastomer) |
| Color | Translucent Amber |
| Durometer | 70 Shore A |
| High Temperature | 280 °C / 536 °F |
| Low Temperature | -15 °C / 5 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -006 |
| Cross Section (CS) | 1.78 mm / 0.070 in |
| Inside Diameter (ID) | 2.90 mm / 0.114 in |
| Other Specifications | |
Semiconductor Material, Filled with Nano Particles of PTFE | |
Filled with Nano Particles of PTFE | |
Canrez® CP70TA11 is a 70 Shore A translucent amber FFKM compound engineered for high-purity semiconductor manufacturing, plasma processing, laser systems, and advanced medical applications. Designed with a nano-PTFE–filled formulation, it delivers ultra-high purity, low etch rate, and minimal particle generation while maintaining near-universal chemical resistance. With a service temperature range of -15°C to 280°C (5°F to 536°F), CP70TA11 provides stable sealing performance in aggressive thermal, chemical, and plasma environments. Its strong plasma resistance and low compression set support long service life in both static and dynamic sealing applications.
CP70TA11 is widely used in dry and wet semiconductor processes including CVD, PECVD, LPCVD, SACVD, RPCVD, HDPCVD, APCVD, PVD, plasma etching, ashing, CMP, oxidation, RTP, wafer cleaning, lamp anneal, and EPI + SiGe processes. It is also well suited for high-purity medical, laser, and plasma-based equipment where contamination control is critical. This Canrez® formulation offers a specialized FFKM solution for advanced process environments requiring exceptional cleanliness and durability. Compare to other popular brands of FFKM materials such as Kalrez® 9100, 8085, and 6375.
Common relevant keywords:
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