FFKM Canrez CP90WH20 O-Ring, Size: -109
Material: FFKM Canrez CP90WH20 O-Ring
Size: AS568 -109 O-Ring
Part Number: CP90WH20-OR-109
CanRez® (Canyon Components)
CP90WH20
FFKM (Perfluoroelastomer)
90
Shore A
Low Temperature Material
Color: White
Detailed Description
CP90WH20-OR-109 is a White, 90 Shore A, FFKM (Perfluoroelastomer) O-Ring made from CanRez® (Canyon Components). CanRez® (Canyon Components) CP90WH20 is manufactured with the following features & specifications: Low Temperature Material. CP90WH20-OR-109 is AS568 size -109 O-Ring also referred to as 2.62mm (Cross Sectional Diameter (CS)) x 7.59mm (Inside Diameter (ID)).
Material: FFKM Canrez CP90WH20 O-Ring
Size: AS568 -109, 2.62mm CS X 7.59mm ID (0.103" CS X 0.299" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | CP90WH20 |
| Brand | CanRez® (Canyon Components) |
| Material | FFKM (Perfluoroelastomer) |
| Color | White |
| Durometer | 90 Shore A |
| High Temperature | 240 °C / 464 °F |
| Low Temperature | -30 °C / -22 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -109 |
| Cross Section (CS) | 2.62 mm / 0.103 in |
| Inside Diameter (ID) | 7.59 mm / 0.299 in |
Canrez® CP90WH20 is a 90 Shore A white, high-purity FFKM compound engineered specifically for semiconductor manufacturing and plasma process environments. It provides near-universal chemical resistance and outstanding stability in both static and dynamic sealing applications exposed to aggressive plasma, vacuum, and diffusion conditions. Designed for clean, contamination-free performance, CP90WH20 offers high durometer strength, resistance to explosive decompression, and long-term durability under high-temperature operation. With a service temperature range of -30°C to 240°C (-22°F to 464°F), it delivers reliable sealing integrity across a wide range of semiconductor processing conditions.
CP90WH20 is ideal for use in semiconductor dry and wet processes including ashing, etching, polishing, PVD, CVD, PECVD, LPCVD, SACVD, HDPCVD, and oxidation, as well as wafer cleaning, lithography, lamp anneal, and EPI + SiGe applications. Its purity and mechanical strength make it suitable for both static chamber seals and dynamic motion components. This Canrez® formulation combines plasma resistance, high purity, and mechanical resilience to provide consistent, clean sealing performance in advanced semiconductor manufacturing environments.