FFKM Chemraz 513 O-Ring, Size: -004
Material: FFKM Chemraz 513 O-Ring
Size: AS568 -004 O-Ring
Part Number: GPC513-OR-004
Chemraz® (Greene Tweed)
513
FFKM (Perfluoroelastomer)
80
Shore A
Semiconductor Material
Color: White
Detailed Description
GPC513-OR-004 is a White, 80 Shore A, FFKM (Perfluoroelastomer) O-Ring made from Chemraz® (Greene Tweed). It is a 80 durometer FFKM (Perfluoroelastomer). Chemraz® (Greene Tweed) 513 is manufactured with the following features & specifications: Semiconductor Material. GPC513-OR-004 is AS568 size -004 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 1.78mm (Inside Diameter (ID)).
Material: 80 Durometer FFKM Chemraz 513 O-Ring
Size: AS568 -004, 1.78mm CS X 1.78mm ID (0.070" CS X 0.070" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | GPC513 |
| Brand | Chemraz® (Greene Tweed) |
| Material | FFKM (Perfluoroelastomer) |
| Color | White |
| Durometer | 80 Shore A Hardness |
| High Temperature | 210 °C / 410 °F |
| Low Temperature | -30 °C / -22 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -004 |
| Cross Section (CS) | 1.78 mm / 0.070 in |
| Inside Diameter (ID) | 1.78 mm / 0.070 in |
| Other Specifications | |
Semiconductor Material | |
Greene Tweed’s Chemraz® 513 is an 80 Shore A white perfluoroelastomer (FFKM) compound developed as a universal sealing material for semiconductor dry processing applications where reliability and low contamination are critical. With a service temperature range of -30°C to 210°C (-22°F to 410°F), it performs consistently in static plasma, photolithography, and diffusion processes where high sealing loads are not required. The compound offers strong plasma resistance, stable mechanical properties, and low extractables, making it well suited for cleanroom and high-vacuum environments. Its balanced hardness allows it to accommodate minor surface finish variations in mating hardware without sacrificing seal integrity.
Chemraz® 513 is commonly used in door and lid seals, slit valves, gas inlet seals, window seals, KF fittings, and isolator valve seals. It supports a wide range of semiconductor processes including CVD, PECVD, PVD, sputtering, plasma etching, ashing, ion implantation, and rapid thermal processing (RTP). This FFKM formulation combines purity, durability, and broad chemical resistance for dependable performance in plasma-exposed and vacuum-based semiconductor systems. Canyon Components offers equivalent FFKM materials designed to meet similar purity, plasma resistance, and temperature requirements for these applications.
Common relevant keywords:
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