FFKM Chemraz 520 O-Ring, Size: -016
Material: FFKM Chemraz 520 O-Ring
Size: AS568 -016 O-Ring
Part Number: GPC520-OR-016
Chemraz® (Greene Tweed)
520
FFKM (Perfluoroelastomer)
90
Shore A
Color: White
Detailed Description
GPC520-OR-016 is a White, 90 Shore A, FFKM (Perfluoroelastomer) O-Ring made from Chemraz® (Greene Tweed). It is a 90 durometer FFKM (Perfluoroelastomer). GPC520-OR-016 is AS568 size -016 O-Ring also referred to as 1.78mm (Cross Sectional Diameter (CS)) x 15.6mm (Inside Diameter (ID)).
Material: 90 Durometer FFKM Chemraz 520 O-Ring
Size: AS568 -016, 1.78mm CS X 15.60mm ID (0.070" CS X 0.614" ID)
| Technical Specification | Value |
|---|---|
| Compound Number | GPC520 |
| Brand | Chemraz® (Greene Tweed) |
| Material | FFKM (Perfluoroelastomer) |
| Color | White |
| Durometer | 90 Shore A Hardness |
| High Temperature | 240 °C / 464 °F |
| Low Temperature | -30 °C / -22 °F |
| Geometry Specifications | |
| Cross Sectional Geometry | O-Ring |
| Size Standard | AS568 |
| Size | -016 |
| Cross Section (CS) | 1.78 mm / 0.070 in |
| Inside Diameter (ID) | 15.60 mm / 0.614 in |
Greene Tweed’s Chemraz® 520 is a 90 Shore A white perfluoroelastomer (FFKM) compound formulated for semiconductor dry processing applications that demand high sealing reliability and minimal contamination. With a service temperature range of -30°C to 240°C (-22°F to 464°F), it delivers dependable performance in static and dynamic plasma environments, diffusion systems, and photolithography processes. Its higher durometer allows it to withstand elevated sealing loads, making it well suited for demanding process chambers and vacuum sealing conditions. The compound combines strong plasma resistance, robust mechanical properties, and low extractables for stable, clean sealing performance in high-purity environments.
Chemraz® 520 is widely used for door seals, slit valves, and isolator valve seals in semiconductor tools. It performs effectively across advanced process applications including CVD, PECVD, PVD, RPCVD, HDPCVD, APCVD, plasma etch, oxidation, diffusion, ashing, ion implantation, and rapid thermal processing (RTP). Compatibility with smooth hardware surface finishes down to 10 µin Ra supports reliable sealing in precision equipment. Canyon Components offers equivalent FFKM materials designed to meet similar plasma resistance, purity, and temperature performance requirements for semiconductor and high-purity applications.
Common relevant keywords:
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