FF374-60 Datasheet

Parker’s FF374-60 is a 60 Shore A deep-purple perfluoroelastomer (FFKM) developed specifically for ultra-low particle generation and minimal extractables in advanced semiconductor plasma environments. As part of the Parofluor ULTRA family, FF374-60 contains no inorganic filler systems and no phosphorus, resulting in extremely low metallic ion content and the lowest extractable levels in its class. Rated for continuous operation up to 600°F (315°C), it maintains a very low erosion rate even in aggressive oxygen and fluorine plasma chemistries where wafer yield and contamination control are critical. Its softer durometer supports effective sealing at lower closure forces while preserving dimensional stability in dry, high-energy plasma processes.

 

FF374-60 is recommended for use in O-rings and molded shapes for deposition and etch applications including CVD, HDPCVD, SACVD, PECVD, and etching or ashing processes. Typical uses include chamber seals, slit valve doors, gate valve doors, ISO valves, wafer pads, target lids, heater and lamp assemblies, and quartz window sealing where particle generation must be tightly controlled. This ultra-clean FFKM formulation is designed for fabs operating at the leading edge of process sensitivity. Canyon Components offers equivalent ultra-low-extractable, low-particle FFKM materials engineered for semiconductor deposition and plasma applications requiring comparable purity, plasma resistance, and thermal capability.

 

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